Technical Capacity

  • Test & Measurement Accessories
  • System design assistance relates to 
    • microscopy
    • optics (light, laser, charged particle, e-beam, ion-beam) 
    • scanning electron microscope
    • laser scanning microscope
    • mass spectrometer (ion trap, quadrupole, TOF)
    • laser
    • detector
      • silicon electron detector (PIN diodes),
      • microchannel plates (MCP)
      • photomultiplier (PMT)
  • Custom Design Analog/Mixed-Domain Electronics for instruments
    • Low noise electronics
      • transimpedance amplifier (TIA)
      • fast settling detection driver
      • ultra-low noise current driver
    • RF driver for mass spectrometer
      • 500kHz - 5MHz, 3kV high voltage RF driver with high stability feedback
    • High voltage driver for controlling electrodes in mass spectrometer, e-beam microscope
    • High stability voltage reference (LTZ1000, LM399, ADR1000, ADR1399, 2DW232, REF70, LTC6655, etc). Capable of delivery sub-ppm noise level performance.
    • High stability voltage source (AD5791, AD5790, DAC11001)
    • >20-bit high resolution ADC acquisition system (LTC2378 and its siblings, various more sigma-delta converters.)
  • High-speed electronics
    • >1GHz amplifier for sensor signal conditioning
    • <100ps rise/fall time pulse/impulse generator
    • >2GSPS 16-bit DAC (LTC2000)
  • Portable Test & Measurement Electronics
    • Battery power/backup
    • Microcontroller programming
    • Communication via USB/UART/RS232/RS485
    • Low noise switching power supplies for sensitive analog load
  • EMI control
    • Expert in control EMI on a multi-layer board and minimize inner board interference to achieve switching-glitch-free signal chain. So you can see the true 1nV/rtHz noise floor on mixed-domain PCB
    • Expert in reduce PCB number of layers in complex mixed-domain data acquisition electronics, while maintaining EMI robustness
  • Complexity reduction
    • Elimination of redundant interface
    • System complexity reduction to improve reliability and robustness, subsequently also reduce cost
  • Cost reduction
    • BOM item merging for non-critical session
    • Components selection of easy of manufacturing
    • Off-shore electronics assembly